Title:
熱硬化性樹脂組成物、プリプレグ、樹脂付フィルム、積層板、多層プリント配線板及び半導体パッケージ
Document Type and Number:
Japanese Patent JP6379675
Kind Code:
B2
Inventors:
Tomohiko Kotake
Hashimoto Shintaro
Shinichiro Abe
Shin Takanezawa
Murai Yo
Hashimoto Shintaro
Shinichiro Abe
Shin Takanezawa
Murai Yo
Application Number:
JP2014110634A
Publication Date:
August 29, 2018
Filing Date:
May 28, 2014
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08L21/00; B32B27/00; C08J5/24; C08K3/013; C08K5/18; C08K5/3415; C08L63/00; C08L83/08; H05K1/03
Domestic Patent References:
| JP2014024926A | ||||
| JP2014024927A | ||||
| JP2012001486A | ||||
| JP63264635A | ||||
| JP2015086253A | ||||
| JP2014129520A | ||||
| JP2014129521A |
Foreign References:
| WO2014084310A1 | ||||
| WO2014084318A1 | ||||
| US20140192501 | ||||
| WO2012099133A1 |
Attorney, Agent or Firm:
Tamotsu Otani
Kenichi Hirasawa
Kenichi Hirasawa