Title:
THERMOSETTING RESIN COMPOSITION, AND PREPREG AND LAMINATE USING THE SAME
Document Type and Number:
Japanese Patent JP2014019773
Kind Code:
A
Abstract:
To provide a thermosetting resin composition having a low thermal expansion, a high glass transition temperature and good dielectric property, excellent in all of copper foil adhesiveness, solder-heat resistance, heat resistance with copper and flame retardancy in a good balance, further having low toxicity and excellent in safety and working environment, and suitable for an electronic component etc.
There is provided: a thermosetting resin composition containing (A) a bismaleimide derivative having polyazomethine represented by following general formula (I) and (B) an aromatic condensed phosphoric ester; and a prepreg and a laminate using the same.
Inventors:
TSUCHIKAWA SHINJI
IZUMI HIROYUKI
MORITA KOJI
IZUMI HIROYUKI
MORITA KOJI
Application Number:
JP2012159074A
Publication Date:
February 03, 2014
Filing Date:
July 17, 2012
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L35/00; C08J5/24; C08K5/521; C08K9/06
Attorney, Agent or Firm:
Tamotsu Otani
Kenichi Hirasawa
Kenichi Hirasawa
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