Title:
THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, PRINTED WIRING BOARD AND MODULE FOR HIGH-SPEED COMMUNICATION
Document Type and Number:
Japanese Patent JP2020200406
Kind Code:
A
Abstract:
To provide a thermosetting resin composition which has high glass transition temperature, excellent heat resistance and low thermal expansion property even if it is not cured at a high temperature of 220°C or higher and is excellent in heat resistance after moisture absorption, dielectric characteristics, pattern moldability, and storage stability of a resin composition, and to provide a prepreg, a laminate, a printed wiring board and a module for high-speed communication using the same.SOLUTION: There is provided a thermosetting resin composition containing: (A) an addition reactant of a maleimide compound (a1) having at least 2 N-substituted maleimide groups in one molecule and an amine compound (a2) having at least two primary amino groups in one molecule; (B) a thermoplastic elastomer; (C) a copolymer resin containing a structural unit derived from an aromatic vinyl compound and a structural unit derived from a carboxylic anhydride; and (D) a curing accelerator, wherein (D) the curing accelerator contains (D1) an imidazole compound having an aliphatic hydrocarbon group having three or more carbon atoms and (D2) an organic phosphorus compound. There are also provided a prepreg, a laminate, a printed wiring board and a module for high-speed communication using the same.SELECTED DRAWING: None
Inventors:
TONAI SHUNSUKE
AITSU SHUJI
SHIMADA TOMOKAZU
FUKUDA TOMIO
NAWATE KATSUHIKO
AITSU SHUJI
SHIMADA TOMOKAZU
FUKUDA TOMIO
NAWATE KATSUHIKO
Application Number:
JP2019108929A
Publication Date:
December 17, 2020
Filing Date:
June 11, 2019
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD
International Classes:
C08L79/00; B32B5/10; B32B27/04; B32B27/18; B32B27/20; B32B27/34; C08G73/12; C08J5/24; C08K3/013; C08K5/3445; C08K5/49; C08L21/00; C08L35/06; C08L53/02; H05K1/03
Attorney, Agent or Firm:
Otani patent office