Title:
THERMOSETTING RESIN COMPOSITION, PREPREG AND LAMINATED PLATE
Document Type and Number:
Japanese Patent JP2015166431
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which is excellent in properties such as high heat resistance, low dielectric constant, low dielectric loss tangent and flame retardancy in a well balanced manner, and to provide a prepreg and a laminated plate for a printed circuit board using the same.SOLUTION: There is provided a thermosetting resin composition which comprises a copolymer resin represented by the following general formula (1) containing (A) a compound having a dihydrobenzoxazine ring, (B) a phenol resin, (C) an epoxy resin, (D) an aromatic vinyl compound and maleic acid anhydride as components, where the amount of the copolymer resin (D) is 9.5 to 15 pts.mass based on 100 pts.mass of the total amount of the organic resin solid content. (where, Rrepresents a hydrogen atom or a hydrocarbon group having 1 to 5 carbon atoms; Reach independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms or an aromatic hydrocarbon group; x represents an integer of 0 to 3; m and n are natural numbers; and the ratio between m and n is 7:1 to 9:1.)
Inventors:
SHIRAOKAWA YOSHIKATSU
KAKIYA MINORU
SUZUKI TAKAYUKI
KAKIYA MINORU
SUZUKI TAKAYUKI
Application Number:
JP2014041566A
Publication Date:
September 24, 2015
Filing Date:
March 04, 2014
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08G59/42; C08J5/24; C08K5/357; C08L35/06; C08L61/06; C08L63/00; H05K1/03
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