To provide a printed wiring board material and a printed wiring board excellent in dielectric characteristics, heat resistance, moisture resistance, electrolytic corrosion resistance, adhesiveness, mechanical characteristics, and chemical resistance, and further exhibiting excellent flame retardancy without using a halogen-based flame retardant.
The thermosetting resin composition includes: (A) a copolymer resin including a repeating unit (a) represented by general formula (I) and a maleic anhydride unit (b) which may have a specific substituent; (B) a cyanate compound having two or more cyanato groups in one molecule; and (C) at least one phosphorus-based flame retardant selected from the group consisting of a phosphazene compound and a metal salt of a di-substituted phosphinic acid, wherein R1 is a hydrogen atom, a halogen atom, or a 1-5C hydrocarbon group; R2 is (when x is 2 or more, each independently) a halogen atom, a 1-5C aliphatic hydrocarbon group, an aromatic hydrocarbon group, or a hydroxyl group; and x is an integer of 0-3.
SHIMIZU HIROSHI
MURAI YASUHIRO
OHASHI KENICHI
AITSU SHUJI
ARATA MICHITOSHI
TSUCHIKAWA SHINJI
| JP2002317085A | 2002-10-31 | |||
| JP2001181388A | 2001-07-03 | |||
| JPH09324108A | 1997-12-16 | |||
| JP2002309085A | 2002-10-23 |
| WO2003087230A1 | 2003-10-23 |
Fusayuki Saito
Satoko Ito