Title:
THERMOSETTING RESIN COMPOSITION, PREPREG, METAL FOIL CLAD LAMINATE, PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP3901134
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which can reduce a coefficient of thermal expansion without lowering moldability and characteristics required for a printed wiring board and a multilayer printed wiring board.
SOLUTION: The composition contains a thermosetting resin and a clayey layered mineral. The interlayers of the clayey layered mineral are subjected to ion exchange with an organic modifying agent represented by formula (1). This weakens the interaction between the layers of the clayey layered mineral to accelerate exfoliation of each layer and makes it possible to uniformly disperse each layer in a nanometer order into the composition. Accordingly, even if the amount formulated of the clayey layered mineral is small, the thermal expansion coefficient can be reduced sufficiently without lowering the moldability and the characteristics required for the printed wiring board and multilayer printed wiring board.
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Inventors:
Toshimasa Konta
Eiichiro Saito
Eiichiro Saito
Application Number:
JP2003181825A
Publication Date:
April 04, 2007
Filing Date:
June 25, 2003
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS,LTD.
International Classes:
C08J5/24; C08L101/00; B32B15/08; B32B15/092; B32B27/20; C08G59/20; C08K9/04; C08L79/00; C08L79/08; H05K1/03; H05K3/46; (IPC1-7): C08L101/00; B32B15/08; B32B27/20; C08G59/20; C08J5/24; C08K9/04; C08L79/00; C08L79/08; H05K1/03; H05K3/46
Domestic Patent References:
| JP4356578A |
Attorney, Agent or Firm:
Keisei Nishikawa
Atsuo Mori
Atsuo Mori
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