Title:
熱硬化性樹脂組成物、それにより製造したプリプレグ、金属箔張積層板及び高周波回路基板
Document Type and Number:
Japanese Patent JP6846540
Kind Code:
B2
Abstract:
Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and a polyphenylene ether resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the polyphenylene ether resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.
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Inventors:
Sominsha
Yang Zhongqiang
Yang Zhongqiang
Application Number:
JP2019557861A
Publication Date:
March 24, 2021
Filing Date:
November 02, 2017
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO.,LTD.
International Classes:
C08L71/02; B32B15/08; B32B27/00; B32B27/04; C08G8/30; C08G61/10; C08J5/24; C08K3/00; C08K5/53; C08L61/14; C08L65/00; C08L101/00; C09J4/06; C09J11/04; C09J171/12; H05K1/03
Domestic Patent References:
| JP2000336261A |
Attorney, Agent or Firm:
Norihito Yamao
Masaishi Nishishita
Masaishi Nishishita