Title:
THERMOSETTING RESIN COMPOSITION, PREPREG USING IT, AND LAMINATE
Document Type and Number:
Japanese Patent JP2009197242
Kind Code:
A
Abstract:
To provide a composition and a prepreg and the like superior in every phase like dielectric properties in spite of use of a non-halogen flame retardant.
The thermosetting resin composition contains (1) a metal salt of a disubstituted phosphinic acid and (2) a specific copolymer such as a resin having a dielectric constant of 2.9 or less at 1 GHz frequency or above. The prepreg and a laminate using the above thermosetting resin composition are also provided.
Inventors:
TSUCHIKAWA SHINJI
ARATA MICHITOSHI
TOMIOKA KENICHI
KOBAYASHI KAZUHITO
ARATA MICHITOSHI
TOMIOKA KENICHI
KOBAYASHI KAZUHITO
Application Number:
JP2009111298A
Publication Date:
September 03, 2009
Filing Date:
April 30, 2009
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L25/02; C08J5/24; C08K5/3477; C08K5/5313; C08L33/14; C08L35/06; C08L63/00; C08L71/12; C08L79/00; H05K1/03
Domestic Patent References:
JP2002317085A | 2002-10-31 | |||
JP2002161211A | 2002-06-04 | |||
JP2000219772A | 2000-08-08 | |||
JPS4974736A | 1974-07-18 | |||
JP2001525327A | 2001-12-11 | |||
JPH0387230A | 1991-04-12 |
Foreign References:
US4777227A | 1988-10-11 |
Attorney, Agent or Firm:
Hajime Tsukuni
Koshiro Tsukuda
Fusayuki Saito
Koshiro Tsukuda
Fusayuki Saito