Title:
熱硬化性樹脂組成物、並びにこれを用いたプリプレグ、銅張積層板及びプリント配線板
Document Type and Number:
Japanese Patent JP6866575
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide: a thermosetting resin composition which may achieve excellent dielectric properties while retaining high adhesion to a copper foil; and a prepreg, a copper-clad laminate and a printed wiring board using the same.SOLUTION: A thermosetting resin composition contains one or more selected from the group consisting of maleimide compounds (A) represented by general formula (1) and prepolymers thereof (A'), and one or more selected from the group consisting of maleimide compounds (B) represented by general formula (2) and prepolymers thereof (B'). Also provided are a prepreg, a copper-clad laminate and a printed wiring board using the same.SELECTED DRAWING: None
Inventors:
Keisuke Kushida
Makoto Yanagida
Shiraoto Yoshikatsu
Kaneko Tatsunori
Makoto Yanagida
Shiraoto Yoshikatsu
Kaneko Tatsunori
Application Number:
JP2016104396A
Publication Date:
April 28, 2021
Filing Date:
May 25, 2016
Export Citation:
Assignee:
Showa Denko Materials Co., Ltd.
International Classes:
C08L79/00; C08J5/24; C08K3/00; C08K5/00; C08L35/00; C08L35/06; C08L63/00; C08L71/00; H05K1/03
Domestic Patent References:
| JP2014114368A | ||||
| JP2008133414A | ||||
| JP1290642A | ||||
| JP64045430A | ||||
| JP2012201751A | ||||
| JP2014101398A |
Attorney, Agent or Firm:
Tamotsu Otani
Kenichi Hirasawa
Kosuke Sawayama
Kenichi Hirasawa
Kosuke Sawayama