熱硬化性樹脂組成物、並びにこれを用いたプリプレグ、積層板及びプリント配線板

Title:

熱硬化性樹脂組成物、並びにこれを用いたプリプレグ、積層板及びプリント配線板

Document Type and Number:

Japanese Patent JP6476599

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition that is excellent in low thermally expandable property, is highly elastic, and has excellent moldability in the press molding of a laminate, and a prepreg, a laminate and a printed wiring board prepared using the same.SOLUTION: A thermosetting resin composition comprises (A) epoxy resin having an ICI viscosity at 150°C of 0.1 Pa s or less, (B) maleimide compound having at least two N-substituted maleimide groups in one molecule, (C) amino compound having at least one amino group in one molecule, and (D) inorganic filler.

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Inventors:

Rei Kanazawa
Takashi Morita
Yukio Nakamura

Application Number:

JP2014118860A

Publication Date:

March 06, 2019

Filing Date:

June 09, 2014

Export Citation:

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Assignee:

Hitachi Chemical Co., Ltd.

International Classes:

C08J5/24; B32B15/08; B32B27/38; C08K3/00; C08K5/17; C08K5/3415; C08L63/00; H05K1/03

Domestic Patent References:

JP2013119588A
JP2012149155A
JP2013221120A
JP2014084452A
JP2013222889A

Foreign References:

WO2012099132A1
WO2012099133A1

Attorney, Agent or Firm:

Tamotsu Otani
Kenichi Hirasawa

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