Title:
THERMOSETTING RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2013256586
Kind Code:
A
Abstract:
To provide a thermosetting resin composition having excellent heat resistance and high toughness.
A thermosetting resin composition contains the following components (A), (B) and (C): (A) a maleimide compound having two or more maleimide groups in a molecule; (B) a phenol compound having two or more structural units represented by general formula (4) (wherein R1 is hydrogen or 1-6C alkyl; and R2 is alkenyl) in a molecule; and (C) rubber particles with a core-shell structure, in which a component having a functional group reactable with at least one of the above resin compounds is disposed at the outer periphery of a core part comprising a rubber component.
Inventors:
MIYAZAKI MANABU
NAKAHASHI AKIKO
NAKAHASHI AKIKO
Application Number:
JP2012133140A
Publication Date:
December 26, 2013
Filing Date:
June 12, 2012
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L35/00; C08K3/00; C08K5/13; C08L51/04; C08L61/14; H01L23/29; H01L23/31
Domestic Patent References:
JP2000156437A | 2000-06-06 | |||
JPH06132426A | 1994-05-13 | |||
JPH05105725A | 1993-04-27 | |||
JPH0675231A | 1994-03-18 | |||
JP2002094243A | 2002-03-29 | |||
JPS6448850A | 1989-02-23 |
Foreign References:
WO2005054331A1 | 2005-06-16 |
Attorney, Agent or Firm:
Masahiko Nishito