Title:
THERMOSETTING RESIN COMPOSITION, RESIN SHEET, AND METAL BASE SUBSTRATE
Document Type and Number:
Japanese Patent JP2022107924
Kind Code:
A
Abstract:
To provide a thermosetting resin composition which gives a resin sheet having a low moisture absorption rate, excellent solder heat resistance after moisture absorption, and excellent thermal conductivity and insulating properties.SOLUTION: The thermosetting resin composition contains (A) an epoxy resin, (B) a thermosetting resin (excluding the epoxy resin (A)), (C) a phenoxy resin having a mesogenic structure in the molecule, (D) thermally conductive particles, and (E) an organosiloxane compound represented by the following general formula (1) (where Q is a C1-20 unsubstituted or substituted monovalent hydrocarbon group; X is a C1-6 unsubstituted or substituted divalent hydrocarbon group; R1 is a hydrogen atom or a C1-10 unsubstituted or substituted monovalent hydrocarbon group, provided that a plurality of R1's may be the same as or different from each other; R2 is a C1-10 unsubstituted or substituted monovalent hydrocarbon group, provided that a plurality of R2's may be the same as or different from each other; and n is 0 or 1).SELECTED DRAWING: None
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Inventors:
KASHINO TOMOMASA
ENDO TADASUKE
ENDO TADASUKE
Application Number:
JP2021002623A
Publication Date:
July 25, 2022
Filing Date:
January 12, 2021
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08L101/00; B32B15/092; B32B27/18; C08K5/549; C08L63/00; C08L71/00
Attorney, Agent or Firm:
Shinji Hayami