Title:
THERMOSETTING RESIN COMPOSITION AND STRUCTURE
Document Type and Number:
Japanese Patent JP2023019588
Kind Code:
A
Abstract:
To provide a thermosetting resin composition capable of achieving a cured product having excellent tracking resistance and a high glass transition temperature.SOLUTION: A thermosetting resin composition of the present invention contains an epoxy resin and a curing agent. The epoxy resin contains an isocyanuric type epoxy resin having at least two epoxy groups and an isocyanuric acid structure in a molecule. A comparative tracking index (CTI) measured according to International Electrotechnical Commission standard IEC-60112 using a cured product of the thermosetting resin composition as a sample is 500 V or more.SELECTED DRAWING: None
Inventors:
NISHIKAWA YOSHIKI
Application Number:
JP2021124427A
Publication Date:
February 09, 2023
Filing Date:
July 29, 2021
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08G59/26; C08G59/32; C08G59/62; H01L23/29
Attorney, Agent or Firm:
Shinji Hayami