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Patent Searching and Data


Title:
THERMOSETTING RESIN COMPOSITION, THERMALLY CURED MATERIAL AND PRODUCTION THEREOF
Document Type and Number:
Japanese Patent JPH0770451
Kind Code:
A
Abstract:

PURPOSE: To obtain the composition for rolls for printing devices, excellent in mechanical characteristics and thermal characteristics and having high water repellency, oil repellency and water resistance and being stable for a long period.

CONSTITUTION: (A) A fluorine-containing radical polymerizable monomer is uniformly dispersed or dissolved in (B) a liquid thermosetting resin and the dispersion or the solution is cast or applied to the surface of a substrate and then, heated. Thereby, the component A is polymerized and simultaneously, the component B is cured to provide the composition in which domain of a polymer of the component A is dispersed on the surface or in the interior of the component B. Furthermore, the component A is preferably a fluorine- containing (meth)acrylate-based resin obtained by polymerizing a perfluoroalkyl group-containing polymerizable monomer of the formula {X is H, Cl, F or methyl; Y is 1-4C alkylene, (CH2)nN(R)SO2 [R is 1-4C alkyl or H; (n) is 1-4]; Rf is a 1-15C fluoroalkyl having perfluoroalkyl group at ends}.


Inventors:
MATSUOKA YOSHIKI
NAKAMURA HIROSHI
YAMATSUTA KOJI
Application Number:
JP6595894A
Publication Date:
March 14, 1995
Filing Date:
April 04, 1994
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO
International Classes:
C08G59/18; C08L33/04; C08L33/14; C08L63/00; C08L101/00; C08L101/04; C09K3/18; (IPC1-7): C08L101/04; C08G59/18; C08L33/14; C08L63/00
Attorney, Agent or Firm:
Takashi Kuboyama (1 person outside)