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Patent Searching and Data


Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0718025
Kind Code:
A
Abstract:

PURPOSE: To obtain the compsn. which can be easily molded, does not produce water as a by-product during curing, and provides a cured article excellent in heat resistance and mechanical properties by compounding three specific compds. and an inorg. filler.

CONSTITUTION: The compsn. is obtd. by compounding a polymaleimide compd. (an arom. bismaleimide compd. is esp. pref.), a methallyl phenyl ether compd. and/or a methallylphenol compd. having at least two methallyl groups in the molecule (pref. a methallyphenol compd. having two methallyl groups), an amine having at least two amino groups in the molecule (pref. an arom. diamine), and an inorg. filler. The compsn. can be easily molded, does not produce water as a by-product during curing, provides a cured article excellent in heat resistance and mechanical properties, and is useful for producing electric insulation materials, prepregs, structural materials. etc., by molding, lamination, etc.


Inventors:
WASHIMI AKIRA
TAKEI MASAO
KIMURA KAORU
Application Number:
JP18893093A
Publication Date:
January 20, 1995
Filing Date:
June 30, 1993
Export Citation:
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Assignee:
TOAGOSEI CO LTD
International Classes:
C08F212/34; C08F12/00; C08F16/32; C08F22/36; C08F216/12; C08F222/40; (IPC1-7): C08F212/34; C08F216/12; C08F222/40
Attorney, Agent or Firm:
Kojima Kiyoji