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Patent Searching and Data


Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2009235162
Kind Code:
A
Abstract:

To provide a thermosetting resin composition to be used preferably as an optical film providing a low birefringence and a solvent resistance at the same time.

The thermosetting resin composition comprises a compound (A) including a carboxyl group obtained by reaction of an ethylene oxide or propylene oxide adduct of bisphenols and an aromatic tetracarboxylic dianhydride or an alicyclic tetracarboxylic dianhydride, and a cross-linking agent (B) having an epoxy group.


Inventors:
EGUCHI MASUICHI
Application Number:
JP2008080175A
Publication Date:
October 15, 2009
Filing Date:
March 26, 2008
Export Citation:
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Assignee:
TORAY INDUSTRIES
International Classes:
C08G59/40; C08G63/668; C08K5/5435; C08L67/00; G02B1/04