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Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2014098168
Kind Code:
A
Abstract:

To provide a thermosetting resin composition which is integrally melted with solder to be capable of component mounting by a reflow process, has good storage stability, and is electrically conductive.

A thermosetting resin composition comprises solder particles having a melting point of 240°C or less, a thermosetting resin binder, and a flux component, where the thermosetting resin binder contains an epoxy resin and a phenolic resin curing agent. The content of the phenolic resin curing agent is 5 to 30 mass% with respect to the epoxy resin.


Inventors:
FUKUHARA YASUO
HINO HIROHISA
Application Number:
JP2014037079A
Publication Date:
May 29, 2014
Filing Date:
February 27, 2014
Export Citation:
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Assignee:
PANASONIC CORP
International Classes:
C08L63/00; C08G59/62; C08K3/00
Domestic Patent References:
JP2008274083A2008-11-13
JP2008510620A2008-04-10
JP2008510621A2008-04-10
JP2009102545A2009-05-14
JP2002363251A2002-12-18
JP2003034747A2003-02-07
JP2005059028A2005-03-10
JP2006016576A2006-01-19
Foreign References:
WO2008023452A12008-02-28
WO2007125650A12007-11-08
Attorney, Agent or Firm:
Keisei Nishikawa
Mizuhiji Katsuhisa
Yoshishige Takeo
Kyohei Tokioka



 
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