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Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2018044096
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition excellent in low thermal expansion coefficient and the like.SOLUTION: A thermosetting resin composition contains fine fibrous cellulose satisfying the following conditions (A)-(E) and a thermosetting resin: (A) the fine fibrous cellulose has a number average fiber diameter of 2-500 nm, (B) it has an average aspect ratio of 10-1000, (C) it has a cellulose I crystal structure, (D) it has an anionic functional group, (E) a polyether amine represented by formula (1) binds to part or all of the anionic functional group described in (D). [R-Reach are a C1-20 linear/branched alkylene group, a C1-20 arylene group or H; n1, n2, and n3 each are 0 or more and 80 or less, (n1+n2+n3) is 10 to 0 or less, AO is an oxyalkylene group having 2 or more and 4 or less carbon atoms, an average value of x is 0.5 or more and 1 or less, an average value of y, z is 0-1].SELECTED DRAWING: None

Inventors:
NAMBA TATSUYA
GOI YOSUKE
JINNO KAZUTO
Application Number:
JP2016181122A
Publication Date:
March 22, 2018
Filing Date:
September 16, 2016
Export Citation:
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Assignee:
DAI ICHI KOGYO SEIYAKU CO LTD
International Classes:
C08L101/00; C08B11/12; C08B15/04; C08G18/64; C08G59/50; C08J5/24; C08L1/08; C08L63/00; C08L75/04
Domestic Patent References:
JP2015143336A2015-08-06
JP2018024878A2018-02-15
JPH0625267A1994-02-01
JP2015000934A2015-01-05



 
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