Title:
THERMOSETTING RESIN COMPOSITION AND THERMOSETTING RESIN
Document Type and Number:
Japanese Patent JP2020152855
Kind Code:
A
Abstract:
To provide a material capable of giving a resin substrate low in dielectric constant and dielectric loss tangent.SOLUTION: A thermosetting resin composition contains: 5-100 pts.mass of a thermosetting resin whose main chain is a polymer of at least one monomer selected from the group consisting of butadiene and isoprene or a hydride thereof and which has a functional group represented by the following formula (1) at its terminal; 100 pts.mass of a resin other than the thermosetting resin; and 10-200 pts.mass of an inorganic filler.SELECTED DRAWING: None
Inventors:
ITO TSUBASA
Application Number:
JP2019054378A
Publication Date:
September 24, 2020
Filing Date:
March 22, 2019
Export Citation:
Assignee:
YOKOHAMA RUBBER CO LTD
International Classes:
C08F299/00; C08C19/28; C08K3/013; C08L15/00; C08L101/00
Domestic Patent References:
| JP2010144117A | 2010-07-01 | |||
| JPH0820678A | 1996-01-23 | |||
| JP2004143411A | 2004-05-20 |
Foreign References:
| WO2017170706A1 | 2017-10-05 | |||
| WO2017150043A1 | 2017-09-08 |
Attorney, Agent or Firm:
Hideaki Ito
Fumio Mitsuhashi
Youichiro Machida
Muto Michiyo
Fumio Mitsuhashi
Youichiro Machida
Muto Michiyo