Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2021181558
Kind Code:
A
Abstract:
To provide a thermosetting resin composition that has excellent adhesion, and has excellent heat resistance and electric characteristics.SOLUTION: A thermosetting resin composition (Z) contains an acid-modified polyolefin (X) and an epoxy resin (Y). The acid-modified polyolefin (X) contains a polyolefin (A) and an unsaturated carboxylic acid (B) as constituent materials. The weight ratio between an ethylene and a C3-8 α-olefin, constituent monomers of the polyolefin (A), [ethylene/C3-8 α-olefin], is 2/98 to 50/50. The unsaturated carboxylic acid (B) is unsaturated monocarboxylic acid, unsaturated polycarboxylic acid, and/or unsaturated polycarboxylic acid anhydride. The acid-modified polyolefin (X) satisfies all of the following requirements (1)-(3). (1) The acid value is 1-100 mgKOH/g. (2) The number average molecular weight (Mn) is 1,000-60,000. (3)The α-olefin moiety has an isotacticity of 1-50%.SELECTED DRAWING: None
Inventors:
HIGUCHI SHINTARO
Application Number:
JP2021067004A
Publication Date:
November 25, 2021
Filing Date:
April 12, 2021
Export Citation:
Assignee:
SANYO CHEMICAL IND LTD
International Classes:
C08L63/00; B32B15/08; B32B27/32; C08L23/26; C09J7/35; C09J123/26; C09J163/00
Previous Patent: JPWO2021181557
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