Title:
熱硬化性樹脂組成物
Document Type and Number:
Japanese Patent JP5144572
Kind Code:
B2
Abstract:
A thermosetting resin composition is provided to secure the proper preserving stability, and to form a cured product with the improved light resistance at a reflector for a printed circuit board and a light emitting device. A thermosetting resin composition contains the following: a material A including a styrene-maleic anhydride copolymer and an organic solvent; and a material B containing a polyfunctional alicyclic epoxy resin, and an inorganic filler. The material A and the material B are stored separately and mixed when using. The inorganic filler includes a titanium oxide. A solder resist cured material is formed by thermosetting the thermosetting resin composition spread on a printed circuit board including a circuit.
Inventors:
Takenori Sumiya
Ayumu Shimamiya
Shigeru Ushiki
Ayumu Shimamiya
Shigeru Ushiki
Application Number:
JP2009076209A
Publication Date:
February 13, 2013
Filing Date:
March 26, 2009
Export Citation:
Assignee:
Taiyo Holdings Co., Ltd.
International Classes:
C08L63/00; C08G59/20; C08G59/42; C08K3/22; C09D7/12; C09D125/04; C09D135/06; C09D163/00; H01L33/60
Domestic Patent References:
| JP200536218A |
Attorney, Agent or Firm:
Amagi International Patent Office