THERMOSETTING RESIN COMPOSITION

Title:

THERMOSETTING RESIN COMPOSITION

Document Type and Number:

Japanese Patent JPH0388810

Kind Code:

A

Abstract:

PURPOSE:To provide the subject composition containing a specific bismaleimide compound as an essential component, giving a three-dimensionally crosslinked cured product by the polymerization reaction of double bond, having excellent moldability, high heat-resistance, low dielectric constant and excellent electrical properties and suitable as an insulation material. CONSTITUTION:The objective composition contains a bismaleimide compound of formula as essential component and further contains preferably a cyanamide compound, cyanato compound, isocyanato compound, epoxy compound, other maleimide compound or various kinds of vinyl compounds.

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Inventors:

NAGAI AKIRA
NISHIMURA SHIN
KATAGIRI JUNICHI
SUZUKI MASAHIRO
SUZUKI MASAO
TAKAHASHI AKIO
KOBI AKIO

Application Number:

JP22444289A

Publication Date:

April 15, 1991

Filing Date:

September 01, 1989

Export Citation:

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Assignee:

HITACHI LTD

International Classes:

C08F22/40; C08F20/52; C08G18/30; C08G59/40; C08G73/06; C08G73/12; (IPC1-7): C08F22/40; C08G18/30; C08G59/40; C08G73/12

Attorney, Agent or Firm:

Katsuo Ogawa (2 outside)

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