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Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH06256456
Kind Code:
A
Abstract:

PURPOSE: To obtain a thermosetting resin composition having good weather resistance, chemical resistance and blocking resistance and being useful as a decorative construction material for articles represented by desks, furniture and wall materials.

CONSTITUTION: This thermosetting resin composition is prepared by mixing 100 pts.wt. urethane-modified epoxy acrylate obtained by reacting the secondary hydroxyl groups of an epoxy acrylate obtained by reacting an epoxy compound having at least one epoxy group in the molecule with an unsaturated monobasic acid with an isocyanate compound having at least two aliphatic isocyanate groups in the molecule with 10-150 pts.wt. aromatic diallyl ester compound and/or its prepolymer, wherein the epoxy acrylate contains 20-100 pts.wt. epoxy acrylate obtained by reacting a hydrogenated bisphenol-A-derived epoxy compound with an unsaturated monobasic acid.


Inventors:
TAKAYANAGI TAKASHI
NAKAMURA HIROSHI
Application Number:
JP4668493A
Publication Date:
September 13, 1994
Filing Date:
March 08, 1993
Export Citation:
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Assignee:
JAPAN U PICA KK
International Classes:
C08G18/58; C08G18/65; C08G18/66; C08G18/67; C08G59/17; C08L75/00; C08L75/04; (IPC1-7): C08G18/58; C08G18/66; C08G18/67; C08G59/17; C08L75/04
Attorney, Agent or Firm:
Akihide Sugimura (5 outside)