To provide a thermosetting resin composition that can form cured coating layer having excellent heat resistance, insulation properties and water resistance that are required in the interlaminar insulating layers in the multilayer printed circuit board and in the solder resist.
This composition includes (A) a cyanate ester bearing 2 or more cyanate groups in one molecule, (B) an epoxy compound bearing 2 or more epoxy groups in one molecule, (C) a metal salt of an aliphatic carboxylic acid and (D) an organic solvent. In a preferred embodiment, a compound that melts at 30-150°C is used as a cyanate ester (A), while the epoxy compound (B) is a phenol or cresol novolak type epoxy resin. In addition, when the flame retardancy is imparted to the composition, an epoxy compound containing 10 or more wt.% of bromine in one molecule is used as the component B. The cyanate ester (A) is preferably formulated so that the cyanate groups may becomes 1.0-3.0 equivalents per one equivalent of the epoxy compound of the component B.
TONI MIYAKO
CHIN KEISHO
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