Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH1180302
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To improve the molding conditions of an oxazine resin excellent in mechanical characteristics, electric characteristics and flameretardance and to especially cure the subject composition at a low temperature by including a specific polyfunctional oxazine compound and a prescribed para-substituted phenol compound. SOLUTION: This composition comprises (A) a polyfunctional oxazine compound containing plural oxazine rings in the molecule [representatively, a compound of formula I ((n) is 1-4; R1 is an aryl; R2 is O or an organic group such as CH2 , etc.) obtained by reacting 1 mol of a phenol compound with at least >=2 mols of formalin and an aromatic primary amine] and (B) a para-substituted phenol compound of formula II [X is COOR (R is H or a 1-5C alkyl), COR or CN; R3 and R5 are each H, a 1-5C alkyl or phenyl] (4-hydroxybenzoic acid methyl ester, etc.) having <=150 deg.C melting point or softening point in the equivalent ratio of the component B to the total oxazine ring in the composition of 0.l-0.8.
Inventors:
MURAI NOBUYUKI
Application Number:
JP25271697A
Publication Date:
March 26, 1999
Filing Date:
September 01, 1997
Export Citation:
Assignee:
SHIKOKU CHEM
International Classes:
C08G8/18; C08G14/073; (IPC1-7): C08G8/18; C08G14/073