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Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS57179215
Kind Code:
A
Abstract:

PURPOSE: The titled composition useful as electronic parts, etc., having improved workability and setting properties as a material for impregnation, laminating, casting, adhesion, and molding, comprising a polyaminobismaleimide, an unsaturated polyester compound, and a triallyl isocyanurate.

CONSTITUTION: (A) 30W60wt% polyaminobismaleimide obtained by heating 1mol N,N'-bismaleimide(e.g., N,N'-ethylenedimaleimide, etc.) shown by the formula (R is bifunctional organic group such as alkylene group, arylene group, aralkylene, etc. and <1mol(preferably 0.2W0.6mol)diamine such as aliphatic diamine (e.g., ethylene diamine)in triallyl isocyanurate is blended with (B) 10W30wt% unsaturated polyester obtained by condensing a dibasic acid component (e.g., terephthalic acid, etc.) with a diol component(e.g., ethylene glycol, etc.), and (C) 10W50wt% triallyl isocyanurate, to give the desired composition. For example, it is heated at 150W180°C for 3W10min and cured.


Inventors:
OGATA MASAJI
ISHII TAKEO
WAJIMA MOTOYO
Application Number:
JP6401481A
Publication Date:
November 04, 1982
Filing Date:
April 30, 1981
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
C08F299/00; C08F283/01; C08F299/04; C08K5/34; C08L67/00; C08L67/06; C08L79/08; (IPC1-7): C08F299/04; C08K5/34; C08L67/06; C08L79/08
Domestic Patent References:
JPS475695A