PURPOSE: A thermosetting resin composition excellent in storage stability, heating stability, etc., and suitable as a solventless varnish, obtained by mixing a polymaleimide with an alkenylphenol (ether) and a specified electron acceptor.
CONSTITUTION: The purpose thermosetting resin composition is obtained by mixing a polymaleimide (e.g., N,N'-ethylenedimaleimide) with an alkenylphenol and/or its ether (e.g., o,o'-diallylbisphenol A or o,o'-diallylbisphenol F) and an electron acceptor selected from among an acid (e.g., hydrochloric or phosphoric acid), an active methylene compound (e.g., cyanoacetic acid or malononitrile) and a π electron acceptor (e.g., 1,3,5-trinitrobenzene or anthraquinone). This resin composition is used as a solventless varnish in impregnation, casting, lamination, molding, bonding, etc.
KATAGIRI JUNICHI
WAJIMA MOTOYO
