Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS61255916
Kind Code:
A
Abstract:

PURPOSE: The titled composition having a low dielectric constant, a small coefficient of linear expansion and excellent heat resistance, comprising a specified bis(cyclopentadienyl) compound and a polymaleimide.

CONSTITUTION: 20W80wt% bis(cyclopentadienyl) compound of formula I (wherein X is a halogen, n is 0W4 and a is 0W20), e.g., α,α'-bis(cyclopentadienyl)-2,3,5,6- tetarchloro-p-xylene oligomer, is mixed with a polymaleimide of formula II (wherein R1 is a b-valent 2C or higher organic group and b is 2W10), e.g., N,N'- p,p'-diphenylmethanebismaleimide, at a temperature ≤100°C in the absence or presence of a solvent (e.g., chloroform), and when a solvent is used, it is recovered by application of vacuum or heat to obtain the titled uniform composition.


Inventors:
FUJIOKA ATSUSHI
MIYADERA YASUO
FUKUDA TOMIO
Application Number:
JP9849885A
Publication Date:
November 13, 1986
Filing Date:
May 09, 1985
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08F20/00; C08F20/52; C08F32/00; C08F222/40; C08F232/00; (IPC1-7): C08F222/40; C08F232/00
Attorney, Agent or Firm:
Kunihiko Wakabayashi