PURPOSE: A thermosetting resin composition that contains, as essential components, an adduct from bismaleimide and an aminobenzoic acid with heat and polyether imide, which are represented by specific formulas, respectively, thus showing high heat resistance, good processability and mechanical properties.

CONSTITUTION: The objective composition is obtained by adding, as essential components, (A) an addition product, which is prepared by reaction between a bismaleimide such as 4, 4'-methylenebis (N-phenylmaleimide) and an aminobenzoic acid at 100°CW150°C, then cooling the reaction product and is represented by formula I (R1 is H, alkyl; R2 is -O-, -CH2-, -SO2-, -S-S-; R3 is H, alkyl, C1), and (B) a polyether imide of formula II (n is positive integer).