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Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS6253330
Kind Code:
A
Abstract:

PURPOSE: The titled composition, obtained by incorporating a specified curing accelerator with a spiroorthocarbonate compound and phenolic resin, having improved dimensional accuracy in molding without volume shrinkage in curing and curable in a short time at low temperatures.

CONSTITUTION: A thermosetting resin composition obtained by incorporating (A) a spiroorthocarbonate group-containing compound expressed by formula I (R1 and R2 are bifunctional organic group) with (B) a phenolic resin and (C) a curing accelerator selected from (i) acetylacetone complex salt based curing accelerators consisting of (trifluoro)acetylacetone complex salt or hexafluoroacetylacetone complex salts, (ii) sulfuric acid ester based curing accelerators consisting of a compound expressed by formula II or III (R3 and R4 are alkyl), (iii) Leiws acid based curing accelerators consisting of salts containing anions selected from BFd4-, PF6-, AsF6- and SbF6- or (iv) organotin compound based curing accelerators consisting of aliphatic or aromatic tin compounds containing bi- or tetravalent Sn.


Inventors:
KISHIMOTO YOSHIHISA
KATO HITOSHI
TAGUCHI HIROKANE
MIZUTANI KIYOKAZU
KATO HIROYUKI
Application Number:
JP1985000192864
Publication Date:
March 09, 1987
Filing Date:
August 31, 1985
Export Citation:
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Assignee:
TOA GOSEI CHEM IND
International Classes:
C08G63/00; C08G64/00; C08G64/20; C08K5/00; C08K5/07; C08K5/15; C08L61/00; C08L61/04; C08L61/06; C08L69/00; (IPC1-7): C08G63/62; C08K5/00; C08K5/07; C08K5/15; C08L61/06; C08L69/00