Title:
熱硬化性樹脂組成物、プリプレグ、積層板及び多層プリント配線板
Document Type and Number:
Japanese Patent JP6705446
Kind Code:
B2
Abstract:
Provided are a thermosetting resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition. Specifically, the thermosetting resin composition contains (A) a polyphenylene ether derivative having an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I) in one molecule, (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds, and (C) a phosphorus flame retardant:
wherein R 1 each independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and x represents an integer of 0 to 4.
Inventors:
Takao Tanikawa
Yasuyuki Mizuno
Tomio Fukuda
Yuki Nagai
Murai Yo
Yasuyuki Mizuno
Tomio Fukuda
Yuki Nagai
Murai Yo
Application Number:
JP2017515634A
Publication Date:
June 03, 2020
Filing Date:
April 28, 2016
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08L71/12; B32B15/08; B32B27/04; B32B27/18; C08G65/48; C08J5/24; C08K3/32; C08K5/51; C08L35/00; C08L63/00; C08L65/00; H05K1/03
Domestic Patent References:
| JP201018791A |
Attorney, Agent or Firm:
Tamotsu Otani
Kenichi Hirasawa
Kosuke Sawayama
Kenichi Hirasawa
Kosuke Sawayama