Title:
熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール
Document Type and Number:
Japanese Patent JP7274114
Kind Code:
B2
Abstract:
To provide a thermosetting resin composition that is halogen-free and prevents a decrease of heat resistance and a deterioration of dielectric properties and has flame retardancy, and is excellent in heat resistance, low thermal expansibility, low relative dielectric constant and low dielectric loss tangent, and a prepreg, a laminate, a printed wiring board and a high-speed communication adaptive module including the same.SOLUTION: A thermosetting resin composition contains (A) an adduct of a maleimide compound (a1) having at least two N-substituted maleimide groups in one molecule and an amine compound (a2) having at least two primary amino groups in one molecule, (B) a thermoplastic elastomer, (C) a copolymer resin containing an aromatic vinyl compound-derived structural unit and a carboxylic acid anhydride-derived structural unit, and (D) a phosphorus flame retardant as a flame retardant.SELECTED DRAWING: None
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Inventors:
Shunsuke Nobouchi
Katsuhiko Nawate
Tomio Fukuda
Tomokazu Shimada
Yukio Nakamura
Toshiyuki Iijima
Katsuhiko Nawate
Tomio Fukuda
Tomokazu Shimada
Yukio Nakamura
Toshiyuki Iijima
Application Number:
JP2022031039A
Publication Date:
May 16, 2023
Filing Date:
March 01, 2022
Export Citation:
Assignee:
Resonac Co., Ltd.
International Classes:
C08F22/40; C08G73/12; C08J5/24; C08K5/49; C08L21/00; C08L25/08; H05K1/03
Domestic Patent References:
| JP2014024926A | ||||
| JP2016529205A | ||||
| JP2008111096A | ||||
| JP2017210545A | ||||
| JP2018520919A |