Title:
半導体封止用熱硬化性樹脂組成物及び半導体装置
Document Type and Number:
Japanese Patent JP7087810
Kind Code:
B2
Abstract:
To provide a thermosetting resin composition for sealing a semiconductor that gives a cured product having excellent tracking resistance and dielectric properties and has excellent continuous formability, and a semiconductor device sealed with a cured product of the resin composition.SOLUTION: A thermosetting resin composition for sealing a semiconductor contains the following components (A)-(E): (A) epoxy resin solid at 25°C, excluding silicone-modified epoxy resin; (B) silicone-modified epoxy resin; (C) cyclic imide compound having, in the molecule, at least one dimer acid skeleton, at least one linear alkylene group with 6 or more carbon atoms, at least one alkyl group with 6 or more carbon atoms, and at least two cyclic imide groups; (D) inorganic filler; (E) anionic curing accelerator.SELECTED DRAWING: None
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Inventors:
Yoshihiro Tsutsumi
Directly to Kushihara
Norifumi Kawamura
Yuki Kudo
Directly to Kushihara
Norifumi Kawamura
Yuki Kudo
Application Number:
JP2018150658A
Publication Date:
June 21, 2022
Filing Date:
August 09, 2018
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08K3/013; C08G59/20; C08L63/00; C08L79/08; H01L23/29; H01L23/31
Domestic Patent References:
| JP2016196548A | ||||
| JP2018531317A | ||||
| JP2018024747A | ||||
| JP2003212957A | ||||
| JP2011132337A | ||||
| JP4351630A | ||||
| JP2018044137A | ||||
| JP2013083958A |
Foreign References:
| WO2016158828A1 | ||||
| WO2018051715A1 |
Attorney, Agent or Firm:
Ushiki International Patent Office
Ushiki Mamoru
Ushiki Mamoru
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