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Patent Searching and Data


Title:
THERMOSETTING RESIN MIXTURE
Document Type and Number:
Japanese Patent JPH01188513
Kind Code:
A
Abstract:

PURPOSE: To obtain a mixture comprising an epoxy resin, an isocyanate resin and a specific reaction accelerator made of cyanoacetoamide, which has long pot life, excellent storage stability and heat-aging resistance, and is suitable for use in electric engineering and electronic engineering.

CONSTITUTION: This thermosetting resin mixture comprises the following. (A) At least one epoxy resin (most preferably aliphatic, alicyclic or aromatic epoxide). (B) At least one isocyanate resin (most preferably aliphatic, alicyclic or aromatic isocyanate). (C) Reaction accelerator of the formula I (R1=-(CR4R5)n- with n=2-24) halogen, nitro, 1-4C alkyl, formula II, formula III, formula IV; R2, R3 1-12C alkyl, halogen, nitro; R2, R3 form 5-7 membered heterocyclic ring in combination with N; R4, R5=H, 1-8C alkyl. (D) If appropriate, a filler and/or further additives conventional in industry.


Inventors:
SAMEERU EICHI ERUDEIN
ARUFURETSUDO RENNAA
Application Number:
JP30586288A
Publication Date:
July 27, 1989
Filing Date:
December 02, 1988
Export Citation:
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Assignee:
CIBA GEIGY AG
International Classes:
C08G18/38; C08G18/18; C08G18/30; C08G18/58; C08G59/40; C08G59/68; (IPC1-7): C08G18/38; C08G18/58
Attorney, Agent or Firm:
Nobuo Kaida (1 person outside)