Title:
THERMOSETTING RESIN MOLDING MATERIAL
Document Type and Number:
Japanese Patent JP3186527
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting resin molding machine obtained by cutting kneaded matter containing a thermosetting resin, an inorg. or org. filler and a curing agent and generating no dust at a time of handling.
SOLUTION: A molding material contains 80wt.% or more of almost cylindrical particles with a height of 1-10mm and a diameter of 2-12mm. Since this molding material generates no fragments upon the reception at a time of the handling of the molding material, dust is not scattered to the circumference.
Inventors:
Hayashi Dai Chatan
Atsushi Abe
Yokomura Shigeru
Keishi Ikeda
Atsushi Abe
Yokomura Shigeru
Keishi Ikeda
Application Number:
JP19093995A
Publication Date:
July 11, 2001
Filing Date:
July 27, 1995
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS,LTD.
International Classes:
B29B9/12; B29B9/14; B29B11/14; B29C47/36; B29K61/04; B29K105/08; (IPC1-7): B29B9/14
Domestic Patent References:
| JP5630433A | ||||
| JP780829A | ||||
| JP55166217A | ||||
| JP6192435A | ||||
| JP7290447A | ||||
| JP7227838A |
Attorney, Agent or Firm:
Junji Ando (1 person outside)