To provide a thermosetting resin having a long pot life and usable in a resin composition for sealants of electronic part apparatuses affording a cured product thereof having excellent heat resistance and low permittivity.
The thermosetting resin comprises a polymerizable compound as follows. The polymerizable compound has a group represented by general formula (1) (wherein, R1 denotes each independently either an allyl group or a methallyl group; and A1 denotes each independently an organic residue derived from a bivalent carboxylic acid) as an end group and a group represented by general formula (2) (wherein, A2 denotes each independently an organic residue derived from a bivalent carboxylic acid or a bivalent carboxylic acid anhydride; and X is each an independent organic residue and denotes each one or more kinds of organic residues consisting essentially of organic residues derived from a compound having an aromatic ring and ≥2 hydroxy group) as a repeating unit.
KAI KAZUFUMI
Takashi Ishida
Tetsuji Koga
Kazuo Yoshii
Masaya Nishiyama
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