Title:
電子部品に使用するための高周波で低い誘電体損の熱硬化性樹脂系
Document Type and Number:
Japanese Patent JP2013521381
Kind Code:
A
Abstract:
The present disclosure provides a thermosetting resin composition including a benzoxazine component comprising two or more benzoxazine monomer compounds and at least one epoxy resin characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards and semiconductor devices.
Inventors:
Tee Tee, Logier
Nguyen, En-Loan
Nguyen, En-Loan
Application Number:
JP2012556195A
Publication Date:
June 10, 2013
Filing Date:
March 02, 2011
Export Citation:
Assignee:
Huntsman Advanced Materials Americas LLC
International Classes:
C08G14/073; C08G59/62; C08J5/24
Attorney, Agent or Firm:
Patent business corporation Odashima patent office