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Patent Searching and Data


Title:
THERMOSETTING TACKY ADHESIVE COMPOSITION AND THERMOSETTING TACKY ADHESIVE SHEET
Document Type and Number:
Japanese Patent JPH0539472
Kind Code:
A
Abstract:

PURPOSE: To obtain the subject composition keeping excellent adhesive force even at an extremely high temperature by compounding specific amounts of an acrylonitrile-butadiene copolymer and an epoxy resin hardener to a specific resin mixture.

CONSTITUTION: The objective composition is produced by compounding (A) 100 pts.wt. of a resin mixture consisting of (i) 50-85wt.% of a liquid epoxy resin (preferably bisphenol A epoxy resin) and (ii) 50-15wt.% (the sum of (i) and (ii) is 100wt.%) of a polyimide oligodiamine compound (preferably a maleimide compound) with (B) 15-75 pts.wt. of an acrylonitrile-butadiene copolymer and (C) 1-10 pts.wt. of an epoxy resin hardener (preferably a crosslinking hardener active at high temperature) as essential components.


Inventors:
YOSHIOKA TAKASHI
MIYAJI NOBUYUKI
UOZUMI HIROSHI
Application Number:
JP33951791A
Publication Date:
February 19, 1993
Filing Date:
November 29, 1991
Export Citation:
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Assignee:
NIPPON CARBIDE KOGYO KK
International Classes:
C08G59/50; C08G59/00; C08G59/40; C08L63/00; C09J7/02; C09J163/00; C09J179/08; (IPC1-7): C08G59/50; C08L63/00; C09J7/02; C09J163/00
Attorney, Agent or Firm:
Hiroshi Nakamoto (2 outside)