THERMOSETTING TYPE ADHESIVE AND ITS BONDING SHEET

Title:

THERMOSETTING TYPE ADHESIVE AND ITS BONDING SHEET

Document Type and Number:

Japanese Patent JPH04266980

Kind Code:

A

Abstract:

PURPOSE: To obtain a thermosetting type adhesive or a bonding sheet, improved in processability and bonding operation efficiency and capable of developing sufficient adhesive strength by heat treatment in a short time and carrying out the bonding treatment excellent in balance between peel adhesive strength and adhesive strength under shear.

CONSTITUTION: A thermosetting type adhesive containing a graft copolymer having ≤0°C glass transition temperature of the backbone chain and 30-150°C glass transition temperature of the side chain, a monomer having at least one radical-reactive unsaturated bond in the molecule and a radical reaction initiator as components. Furthermore, a bonding sheet having a layer composed of the aforementioned thermosetting type adhesive on a support is provided.

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Inventors:

ANDO MASAHIKO
TOZAKI YUTAKA
MOROISHI YUTAKA
HASEGAWA YOSHIJI
NAKAMURA KOICHI
WADA HIROSHI

Application Number:

JP4889491A

Publication Date:

September 22, 1992

Filing Date:

February 20, 1991

Export Citation:

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Assignee:

NITTO DENKO CORP

International Classes:

C08F299/02; C08F290/00; C09J4/00; C09J7/02; (IPC1-7): C08F299/02; C09J4/00; C09J7/02

Attorney, Agent or Firm:

Tsutomu Fujimoto

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