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Title:
THERMOSETTING WATERWEED-PROOFING COATING COMPOSITION, METHOD FOR FORMING WATERWEED-PROOFING COATING FILM, AND METAL PLATE WITH WATERWEED-PROOFING COATING FILM
Document Type and Number:
Japanese Patent JPH11130990
Kind Code:
A
Abstract:

To provide a waterweed-proofing metal plate for those on which waterweed grows, such as a building structure by providing a baking-cured coating film of excellent resistance with waterweed-proofing properties using a certain waterweed-proofing agent.

A thermosetting waterweed-proofing coating composition comprises (A) a thermosetting resin, (B) at least one curing agent selected from an amino resin and a block polyisocyanate compound and (C) S-triazine-based compound, wherein the (C) S-triazine-based compound is present at a level of 0.5-25 pts.wt. based on 100 pts.wt. of a solid content in components (A) and (B) and the (A)/(B) ratio is 100/5-100/60. The (C) S-triazine-based compound is preferably at least one kind selected from 2-methylthio-4,6-bis(ethylamino)-S- triazine, 2-methylthio-4-ethylamino-6-isopropylamino-S-triazine and 2- methylthio-4,6-bis(isopropylamino)-S-triazine.


Inventors:
ODAWA TAKETOSHI
YAMAMOTO NAOTAKA
Application Number:
JP29458897A
Publication Date:
May 18, 1999
Filing Date:
October 27, 1997
Export Citation:
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Assignee:
NIPPON PAINT CO LTD
International Classes:
B05D5/00; B05D7/24; C09D5/14; C09D7/12; C09D161/20; C09D175/04; C09D201/00; (IPC1-7): C09D5/14; B05D5/00; B05D7/24; C09D7/12; C09D161/20; C09D175/04; C09D201/00
Attorney, Agent or Firm:
Kenji Yoshida (2 outside)