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Title:
廃棄プリント基板を非焼却、非シアン化処理する方法
Document Type and Number:
Japanese Patent JP2014510195
Kind Code:
A
Abstract:
A burning-free and non-cyanide method for recycling waste printed circuit board is provided, comprising the following steps: desoldering to separate lead and tin; crashing and electrostatic selecting to respectively extract stibium, aluminum, copper, nickel, silver, gold, platinum and palladium. The method can realize the maximization of recycling of valuable metal resources, can thoroughly separate the metal lead and tin for recycling, and meanwhile increase the recycling rate of the metal palladium.

Inventors:
Skaihua
Application Number:
JP2013555726A
Publication Date:
April 24, 2014
Filing Date:
July 28, 2011
Export Citation:
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Assignee:
SHENZHEN GEM HIGH-TECHCO., LTD.
International Classes:
C22B7/00; B09B3/00; B09B5/00; C22B11/00; C22B13/00; C22B15/00; C22B21/00; C22B23/00; C22B25/06; C22B30/02; C23F1/30; C25C1/08; C25C1/12; C25C1/20
Domestic Patent References:
JPH1136020A1999-02-09
JPH09324222A1997-12-16
Foreign References:
WO2009087908A12009-07-16
Attorney, Agent or Firm:
Iseki Katsumori
Tanaka rice