THICK-BAKED WAFER SHEET AND METHOD FOR PRODUCING THE SAME

Title:

THICK-BAKED WAFER SHEET AND METHOD FOR PRODUCING THE SAME

Document Type and Number:

Japanese Patent JP2003333984

Kind Code:

A

Abstract:

To provide a thick-baked wafer sheet having adequate hardness and filling texture when eaten, having a feeling with a crunching sound, smoothly melting in mouth and accepted as a sort of confectionery as it stands and provide a method for producing the wafer sheet.

The thick-baked wafer sheet is produced by using raw material powder in which a hydroxypropyl starch having 0.07-0.18 substitution degree occupies ≥50 mass% content. The method for producing the thick-baked wafer sheet comprises using the raw material powder in which the hydroxypropyl starch having 0.07-0.18 substitution degree occupies ≥50 mass% content.

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Inventors:

KOBAYASHI KOJI
TAKEMAE KOKICHI
TSUBOMOTO HOZUMI
SATO SUSUMU

Application Number:

JP2002144375A

Publication Date:

November 25, 2003

Filing Date:

May 20, 2002

Export Citation:

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Assignee:

BOURBON CORP
MATSUTANI KAGAKU KOGYO KK

International Classes:

A21D13/08; A21D2/18; (IPC1-7): A21D13/08; A21D2/18

Attorney, Agent or Firm:

Minoru Nakamura (9 outside)

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