Title:
THICK COPPER EMBEDDED CIRCUIT BOARD STRUCTURE
Document Type and Number:
Japanese Patent JP2023063761
Kind Code:
A
Abstract:
To improve heat dissipation of circuit boards.SOLUTION: One embodiment of a circuit board has a conductive base, an insulating layer disposed on the conductive base, and a thick copper circuit part embedded in the insulating layer with a portion of the thick copper circuit part exposed, and the thick copper circuit part is embedded in the insulating layer with more than 50% of its surface area covered by the insulating layer.SELECTED DRAWING: Figure 2
Inventors:
BABA TORU
KUMAGAI RYOTA
KUMAGAI RYOTA
Application Number:
JP2021173760A
Publication Date:
May 10, 2023
Filing Date:
October 25, 2021
Export Citation:
Assignee:
DENKA CO LTD
International Classes:
H05K1/02; H05K1/03
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Takeshi Nakatsuka
Okumura Daisuke
Yoshinori Shimizu
Takeshi Nakatsuka
Okumura Daisuke
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