PURPOSE: To improve productivity by economization of costly electroless plating materials in the production of printed substrates by punching terminal holes to a substrate stuck with a copper foil then subjecting the same to pattern printing then to an electroless plating treatment after passing the same through stages for printing of permanent resist and printing of resist for preventing sticking of catalysts.

CONSTITUTION: After a copper coil 2 is press-stuck on the surface of a substrate 1 of a glass resin, ceramics, etc., many terminal holes 3 are punched according to desired circuits and the surface is buffed. Patterns 5 corresponding to circuits are printed thereon and are dried; thereafter the copper coil 2 except the patterns 5 and round parts 7 is removed. In succession, the patterns 5 are removed with an NaOH soln. to leave the parts 7 around the holes 3, and permanent resist 6 is printed. Resist 8 for preventing sticking of catalysts is printed and after catalysts are stuck and the resist 8 is stripped, copper or nickel is plated 4 thickly by electroless plating in the holes 3 and on the parts 7.