Title:
THICK FILM CONDUCTOR MADE OF NON-OXIDIZED STEEL
Document Type and Number:
Japanese Patent JPH01220303
Kind Code:
A
Abstract:
PURPOSE: To provide a non-oxidizing copper thick film conductor which possesses excellent adhesion properties by a method in which a non-oxidizing steel thick film conductor includes given elements, and the weight of boron manganese compound is in the prescribed range based on the whole conductor weight, and a phosphoric acid content attains a predetermined amount relative to the metal copper weight. CONSTITUTION: This non-oxidizing copper thick film conductor is made of copper composed of metal copper powder and copper oxide powder (a), and includes boron manganese compound (b), acid containing inorganic phosphoric acid (c), and organic vehicle (d). Moreover, the concentration of boron manganese compound is in the range from 0.5 to 1.5wt.% based on the whole conductor weight, and a phosphoric acid content is in the range from 50 to 300ppm based on the metal copper powder weight. Thus, the non-oxidizing copper thick film conductor which can be heated in a nitrogen gas to facilitate soldering can be obtained.
Inventors:
JIERII AI SUTAINBAAGU
Application Number:
JP27719188A
Publication Date:
September 04, 1989
Filing Date:
November 01, 1988
Export Citation:
Assignee:
HEREEASU INC
International Classes:
B22F1/02; C22C1/04; H01B1/16; H01B1/22; H01L23/498; H05K1/09; B23K35/22; H05K1/16; (IPC1-7): B22F1/02; B23K35/22; C22C1/04; H01B1/22; H05K1/16
Attorney, Agent or Firm:
Minoru Nakamura (8 outside)
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