PURPOSE: To realize a thick film magnetic material chip component, which is small-sized, is low in height, is superior in mounting property and is rich in film productivity, as the noise counter-measure component of a high-density mounting circuit board, which is accompanied by a miniaturization of a digital equipment and a reduction in the thickness of the digital equipment.

CONSTITUTION: A thick film magnetic material chip component is provided with a square plate-shaped ceramic substrate 14, a magnetic material layer 11, which is formed on the substrate 14, is internally provided with an internal conductor 13 therein and at the same time, is thermodiffused a low-softening point glass or a thermosoftening resin, and one pair of end face electrodes 12 connected electrically with the conductor 13 at both end parts of the substrate 14, whereby the mounting property and mass productivity of the chip component can be respectively improved into a superior one and the thick film magnetic material chip component, which is superior also in plating resistance, is obtained.