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Patent Searching and Data


Title:
THICK FILM PRINTED COIL AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH10290544
Kind Code:
A
Abstract:

To reduce the diameter of a conductor section which connects coil patterns on the front and rear surfaces of a thick film printed coil for motor to each other and, at the same time, to increase the mechanical strength of the conductor section.

A laminated board formed by sticking copper foil 2 to both surfaces of an insulating substrate 1 is used. Before a thick film printed coil is manufactured, a through hole 3 is formed through the laminated board at a necessary spot and a plated layer 4 is formed on the internal surface of the hole 3. Coil conductor patterns are formed on the front and rear surfaces of the laminated board by etching, and electroplating is performed so as to make the cross-sectional areas of the conductor patterns larger. When the electroplating is performed, thick electroplated layers 7 are formed on the patterns 6 in the thickness direction and the hole 3 is filled up with an electroplated layer, resulting in the formation of a through conductor section 8. Since the through conductor section 8 filled up with a conductor to its center has a high mechanical strength and has a conductor having a larger cross-sectional area, the current capacity of the printed coil becomes larger.


Inventors:
KAI SUKEO
Application Number:
JP9569897A
Publication Date:
October 27, 1998
Filing Date:
April 14, 1997
Export Citation:
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Assignee:
SMC KK
International Classes:
H05K1/16; H01F41/04; H02K3/26; (IPC1-7): H02K3/26; H01F41/04; H05K1/16
Attorney, Agent or Firm:
Hisao Komori