PURPOSE: To obtain high integration resistor circuits by placing thick film resistors in piles on an insulating substrate through layer insulating films wherein conductors or resistance substances are provided in the through hole of the layer insulating films for reciprocal connection.

CONSTITUTION: Consecutive thick film resistors 14a∼14c are piled up and formed with the same pattern on an insulating substrate 1 through layer insulating films 4, 5. Wherein the resistors are formed by riding in a three-layer shape and reciprocally connected through conductors 15 in the through hole of the layer insulating films. In this composition, packaging density will be improved. Furthermore, if trimming cut is done for a place, three places 16a∼16c will be cut with the same pattern. Therefore, the exothermic distribution of the resistors will be equalized to obtain reliable resistor circuits and the adjustment of resistance values will be carried out in a short period.