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Patent Searching and Data


Title:
THICK FILM RESISTOR AND MANUFACTURING METHOD OF THICK FILM RESISTOR
Document Type and Number:
Japanese Patent JP2001093337
Kind Code:
A
Abstract:

To provide a small-size thick film resistor reduceable in thickness even when there is a small space between two conductors.

A conductor 2 comprising a elongated rectangle and a square having sides shorter than long sides of the rectangle and put on the long sides of the rectangle with mutual end points corresponding to each other, and a conductor 3 which is a rectangle having long sides equal in length to the long sides of the rectangle of the conductor 2 and arranged with the long sides of the conductors 2, 3 opposed and parallelled to each other, are printed on an insulating substrate 1, followed by levelling, drying and firing. Then, a rectangular resistor is printed on the surface at the upper side of the rectangle and square of the conductor 2, on the conductor 3, on the insulating substrate 1 located between two opposed sides of the conductor 2 and the conductor 3, and on a region A on the insulating substrate 1 separated from a region between two sides, while moving a squeezer 7 from the thinner side to the thicker side of the conductor 2. The resistor 4 in a groove formed between the conductor 2 and the conductor 3 is printed at a small thickness. The wetting performance of the resistor 4 to the insulating substrate 4 is improved and the resistor 4 is spread over the insulating substrate 4 by levelling.


Inventors:
OISHI MANABU
MASUDA TERUAKI
Application Number:
JP27491099A
Publication Date:
April 06, 2001
Filing Date:
September 28, 1999
Export Citation:
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Assignee:
YAZAKI CORP
International Classes:
H01C17/06; H01B5/14; H01C7/00; H05K1/16; (IPC1-7): H01B5/14; H01C7/00; H01C17/06; H05K1/16
Attorney, Agent or Firm:
Hidekazu Miyoshi (8 outside)