Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
THICK-FILM RESISTOR PASTE
Document Type and Number:
Japanese Patent JPH03167801
Kind Code:
A
Abstract:

PURPOSE: To reduce fluctuations in resistance value under high temperature with excellent junction with an AlN substrate by containing mainly the powder of conductive material and of a borosilicate zinc glass and by mixing a specified amount of powder which is specified to the main constituent.

CONSTITUTION: A thick-file resistor paste excellent in junction with an AlN substrate is formed by containing mainly the powder of a conductive material and of a borosilicate zinc glass and is mixed with the powder of at least MnO2,TiO2, Cr2O3, and MoO3 by 40wt.% or less to the main constituent. Using such a thick-file resistor paste allows the formation of thick-films excellent in junction with an AlN substrate in high reliability with small fluctuations in resistance value under high temperature and in electric characteristics with small TCR.


Inventors:
OKAMOTO YOSHIAKI
IWASE NOBUO
Application Number:
JP30651189A
Publication Date:
July 19, 1991
Filing Date:
November 28, 1989
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOSHIBA CORP
International Classes:
H01C7/00; (IPC1-7): H01C7/00
Attorney, Agent or Firm:
Noriyuki Noriyuki (1 person outside)